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SOT series

SOT series

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SOT series

发布时间:2012-09-14

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所属行业:大半导体备品备件»半导体封装

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南通富士通微电子股份有限公司

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Production Overview



Plastic Small Outline Transistor packaging (SOT) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SOT23 ,SC70,SOT89,SOT223 packages.



Application



Small Outline Transistor packages are considered one of the most established industry standard packages. SOT is commonly used in wireless/RF and analog devices, portable products such as cell phones, data storage systems, notebook computers and pagers.



Features



* JEDEC standard compliant or reference

* Wide choice of pad sizes to meet die size per customer lead frame design capability

* Pb-free process ready and Green Molding Compound


(1mm=39.37mil; 1mil=25.4um)



Reliability Test Standards



The test criterion is zero defect out of 77 sampling units.


JEDEC Precondition :J-STD-20/JESD22-A113


























Temp/Humidity Test



85°C/ 85% RH, JEDEC 22- A101



Pressure Cooker Test



121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102



Temp Cycle Test



-65 ~ 150°C, JEDEC22-A104



High Temp Storage Test



150°C, JEDEC 22- A103



High Accelerated Stress Test



130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118




Design Rule


Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping


Maximum Ink Height: 1mil(25um)


Minimum Sawing street width: 2.4mil (60um)


Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.































Pkg type



Pkg size



Wafer thickness



SOT



SOT23



9.5~11mil (240~280 um)



SOT



SC70



6.7~8.3 mil (170~210 um)



SOT



SOT223



9.5~13.4 mil (240~340 um)



SOT



SOT89



9.5~13.4mil (240~340 um)




Wire Bond Rule






























































Wire size



Min. bond pad pitch



Min. bond pad opening



Wire loop control





50um (2.0mil)



200 um



150 um



Max. wire length

loop height



5000um

<300um



38um (1.5mil)



170 um



100um



Max. wire length

loop height



5000um

<300um



33 um (1.3mil)



150 um



90 um



Max. wire length

loop height



5000um

<300um



30 um (1.2mil)



150um



90 um



Max. wire length

loop height



5000um

<300um



25um (1.0mil)



70um



60um



Max. wire length

loop height



5000um

<300um



23um (0.9mil)



60 um



50um



Max. wire length

loop height



3000um

<300um



20 um (0.8mil)



60 um



50 um



Max. wire length

loop height



3000um

<300um




Package Outline



SOT (All units are in mm)














































































PKG TYPE



Lead count



Lead Pitch



Lead Width



LeadThickness



BD



POD



SOT23



3



0.95



0.38



0.15



DOWN



DOWN



SOT23



5



0.95



0.38



0.15



DOWN



DOWN



SOT23



6



0.95



0.38



0.15



DOWN



DOWN



SC70



5



0.65



0.25



0.13



DOWN



DOWN



SC70



6



0.65



0.25



0.13



DOWN



DOWN



SOT89



4



1.50



0.40



0.40



DOWN



DOWN



SOT223



4



2.30



0.71



0.30



DOWN



DOWN




Packing & Shipping(Carrier Tape)































































PKG TYPE



Lead count



Tape Width



Reel Diameter



QTY/Reel



SOT23



3



8mm



7”



3000



SOT23



5



8mm



7”



3000



SOT23



6



8mm



7”



3000



SC70



5



8mm



7”



3000



SC70



6



8mm



7”



3000



SOT89



4



12mm



7”/13”



1000/2500



SOT223



4



12mm



7”/13”



1000/2500


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